tuya T5 Module Developer Platform Instructions

This topic is intended to provide hardware information and serve as a reference when you develop with T5-E1 modules.
It helps you get an overall understanding of the product specifications and assists in developing products and applications.

زيادةview

T5-E1-IPEX is a highly integrated single-antenna single-band 2.4 GHz Wi-Fi 6 (IEEE 802.11b/g/n/ax) and Bluetooth 5.4 Low Energy (LE) combo IoT module.
Featuring a multi-peripheral packaging and ultra-low-power chip, the T5-E1-IPEX module provides a highly integrated, efficient, secure, and lowest-power environment for IP cameras, HMI applications, smart locks, and other advanced IoT applications.
The T5-E1 module is embedded with an ARMv8-M Star (M33F) processor with a clock rate of up to 480 MHz, and integrates 8 MB flash memory, 16 MB PSRAM, 640 KB SRAM shared memory, and 64 KB ROM.
Support interfaces such as USB, UART, SDIO, SPI, I2C, I2S, and ADC, as well as external devices such as displays, cameras, microphones, speakers, and microSD cards.

مظهر

Pins on the module

T5-E1 is equipped with a total of 70 pins, including 40 LCC pins and 30 LGA pins.

The pinout is as follows:

لا.	اسم	نوع الإدخال / الإخراج	وصف
1	أرضي	P	دبوس الأرض
2	3 فولت 3	P	دبوس الطاقة
3	ر.س.ت	I	The low-level reset pin is active high and pulled up internally
4	ص20	إدخال/إخراج	GPIO20 I2C0_SCL سوكليك RGB_R6 I8080_D9 SEG10
5	ص21	إدخال/إخراج	I2C0_SDA سوديو أيه دي سي 6 RGB_R5 I8080_D8 SEG9
6	ص22	إدخال/إخراج	CLK26M أيه دي سي 5 QSPI0_SCK RGB_R4 I8080_CSX SEG8
7	ص23	إدخال/إخراج	أيه دي سي 3 QSPI0_CS RGB_R3 I8080_RESET SEG7
8	ص24	إدخال/إخراج	LPO_CLK PWMG0_PWM4 أيه دي سي 2 QSPI0_IO0 RGB_G7 I8080_RSX SEG6
9	ص25	إدخال/إخراج	هيئة تنظيم الصناعة والتعدين أيه دي سي 1 QSPI0_IO1 RGB_G6 I8080_WRX SEG5
10	ص26	إدخال/إخراج	QSPI0_IO2 RGB_G5 I8080_RDX SEG4
11	ص28	إدخال/إخراج	I2S_MCLK أيه دي سي 4 تاتش2 CLK_AUXS_CIS SEG18
12	P1	إدخال/إخراج	UART1_RX I2C1_SDA سوديو SC_CLK أيه دي سي 13 LIN_RXD
13	DN	إدخال/إخراج	يو اس بي د-
14	DP	إدخال/إخراج	USB D +
15	P0	إدخال/إخراج	UART1_TX I2C1_SCL سوكليك SC_IO أيه دي سي 12 LIN_TXD
16	P9	إدخال/إخراج	I2S0_DOUT DMIC_DAT 32K_XI
17	P8	إدخال/إخراج	I2S0_DIN DMIC_CLK أيه دي سي 10 32K_XO
18	P7	إدخال/إخراج	I2S0_SYNC QSPI1_IO3
19	P6	إدخال/إخراج	I2S0_SCK QSPI1_IO2
20	P5	إدخال/إخراج	SPI1_MISO بيانات SDIO_1 كوم7 QSPI1_IO1 SEG31
21	P4	إدخال/إخراج	SPI1_MOSI بيانات SDIO_0 كوم6 QSPI1_IO0 SEG30
22	P3	إدخال/إخراج	SPI1_CSN SDIO_CMD SC_VCC QSPI1_CS
23	P2	إدخال/إخراج	SPI1_SCK SDIO_CLK SC_RSTN LIN_SLEEP QSPI1_SCK
24	ص12	إدخال/إخراج	UART0_RTS تاتش0 أيه دي سي 14
25	ص13	إدخال/إخراج	UART0_CTS تاتش1 أيه دي سي 15
26	ص15	إدخال/إخراج	SDIO_CMD SPI0_CSN I2C1_SDA RGB_DISP I8080_D14 SEG15
27	ص14	إدخال/إخراج	SDIO_CLK SPI0_SCK I2C1_SCL RGB_DCLK I8080_D15 SEG16
28	ص16	إدخال/إخراج	بيانات SDIO_0 SPI0_MOSI RGB_DE I8080_D13 SEG14
29	ص17	إدخال/إخراج	بيانات SDIO_1 SPI0_MISO RGB_HSYNC I8080_D12 SEG13
30	ص18	إدخال/إخراج	بيانات SDIO_2 PWMG0_PWM0 RGB_VSYNC I8080_D11 SEG12
31	ص19	إدخال/إخراج	بيانات SDIO_3 RGB_R7 I8080_D10 SEG11
32	ص47	إدخال/إخراج	SPI0_MISO ENET_MDC تاتش15 RGB_B3 I8080_D0 كوم0 I2S2_DOUT
33	ص46	إدخال/إخراج	CAN_STBY SPI0_MOSI ENET_PHY_INT تاتش14 RGB_B4 I8080_D1 كوم1 I2S2_DIN
34	ص45	إدخال/إخراج	CAN_RX SPI0_CSN RGB_B5 I8080_D2 كوم2 I2S2_SYNC
35	ص44	إدخال/إخراج	CAN_TX SPI0_SCK RGB_B6 I8080_D3 كوم3 I2S2_SCK
36	ار اكس دي	إدخال/إخراج	DL_UART_RX بيانات SDIO_2 CLK_AUXS_CIS UART0_RX Flash firmware and authorize modules
37	TXD	إدخال/إخراج	DL_UART_TX UART0_TX بيانات SDIO_3 Flash firmware and authorize modules
38	ص43	إدخال/إخراج	I2C1_SDA I2S1_DOUT SC_VCC RGB_B7 I8080_D4 SEG0
39	ص42	إدخال/إخراج	I2C1_SCL I2S1_DIN LIN_SLEEP SC_RSTN RGB_G2 I8080_D5 SEG1
40	أرضي	P	دبوس الأرض
41	ص27	إدخال/إخراج	CIS_MCLK CLK_AUXS_CIS ENET_PHY_INT QSPI0_IO3 SEG17
42	ص29	إدخال/إخراج	CIS_PCLK ENET_MDC تاتش3 SEG19
43	أرضي	P	دبوس الأرض
44	أرضي	P	دبوس الأرض
45	ص41	إدخال/إخراج	UART2_TX I2S1_SYNC LIN_TXD SC_IO RGB_G3 I8080_D6 SEG2
46	ص31	إدخال/إخراج	CIS_VSYNC UART2_TX LIN_TXD تاتش5 SC_IO SEG21
47	ص30	إدخال/إخراج	CIS_HSYNC UART2_RX LIN_RXD تاتش4 SC_CLK SEG20
48	ص33	إدخال/إخراج	CIS_PXD1 ENET_RXD0 تاتش7 SEG23
49	ص32	إدخال/إخراج	CIS_PXD0 PWMG1_PWM0 ENET_MDIO تاتش6 SC_RSTN SEG22
50	أرضي	P	دبوس الأرض
51	ص34	إدخال/إخراج	CIS_PXD2 PWMG1_PWM2 ENET_RXD1 تاتش8 SPI0_CSN SEG24
52	ص35	إدخال/إخراج	CIS_PXD3 ENET_RXDV تاتش9 SPI0_MOSI SEG25
53	أرضي	P	دبوس الأرض
54	أرضي	P	دبوس الأرض
55	أرضي	P	دبوس الأرض
56	ص36	إدخال/إخراج	CIS_PXD4 PWMG1_PWM4 ENET_TXD0 تاتش10 SPI0_MISO SEG26
57	ص37	إدخال/إخراج	CIS_PXD5 ENET_TXD1 تاتش11 SEG27
58	أرضي	P	دبوس الأرض
59	أرضي	P	دبوس الأرض
60	فيو	AO	GPIO LDO output
61	LN	AO	Audio left channel negative output
62	LP	AO	إخراج إيجابي للقناة اليسرى للصوت
63	ص38	إدخال/إخراج	CIS_PXD6 I2C1_SCL ENET_TXEN تاتش12 كوم4 SEG28
64	ص39	إدخال/إخراج	CIS_PXD7 I2C1_SDA ENET_REF_CLK تاتش13 كوم5 SEG29
65	ص40	إدخال/إخراج	UART2_RX I2S1_SCK LIN_RXD SC_CLK RGB_G4 I8080_D7 SEG3
66	إم بي 1	AO	Microphone 1 positive input
67	م ن 1	AO	Microphone 1 negative input
68	م ن 2	AO	Microphone 2 negative input
69	إم بي 2	AO	Microphone 2 positive input
70	م ب س	AO	إخراج انحياز الميكروفون

ملحوظة:

The maximum input level for the ADC pin is 1.1V. It is recommended to use MΩ-level external voltage divider resistors and place a 100nF capacitor close to the ADC pin for grounding and filtering.
P indicates the power pin.
I/O indicates the input and output pins.
AI indicates the analog signal input pin.
AO indicates the analog signal output pin.

Pin configuration and features

يو آر تي وصف الدبوس

The module provides three UART interfaces:

UART 0: used to connect to your MCU. The serial data transmission follows Tuya’s protocol. The baud rate is 115200 bps by default.
UART 1: used to connect to peripheral devices.
UART 2: used to connect to peripheral devices.

رقم التعريف الشخصي	إشارة	ميزة
36	DL_UART_RX	UART 0. It can be used as a download port to receive data.
37	DL_UART_TX	UART 0. It can be used as a download port to transmit data.
12	UART1_RX	UART 1 to receive data.
15	UART1_TX	UART 1 to transmit data.
45	UART2_TX	UART 2 to transmit data.
65	UART2_RX	UART 2 to receive data.

Serial communication between the module and the MCU

Connection between a module and a 3.3V MCU
Connection between a module and a 5V MCU
In the following circuit diagram, voltage level translation can be implemented with a bidirectional voltage-level translator, a MOS transistor, or a triode.

Level translator reference

N-channel MOSFET level translator: An N-channel MOSFET and a built-in body diode are used to implement two-way communication.
NPN triode level translator: An NPN triode is used to implement one-way communication.
See the circuit diagram above for how UART 1, UART 2, and UART 0 are connected.

تصميم الدوائر

The UART trace should be as short as possible. Add ground vias around the UART and keep away from RF and periodic signal lines.

USB

وصف الدبوس

The USB interface conforms to USB 2.0 specifications.
It is recommended to reserve a USB port for program download and debugging.

رقم التعريف الشخصي	إشارة	ميزة
13	`USB_DN`	USB high-speed differential transceiver (negative). It can be used to download code to the module.
14	`USB_DP`	USB high-speed differential transceiver (positive). It can be used to download code to the module.

التطبيقات

MCU solutions
كابل Micro-USB

تصميم الدوائر

Make sure to route the USB signal traces as differential pairs with total grounding, keeping them parallel and of equal length. The impedance of the USB differential trace is 90Ω.
Do not route signal traces under the power supply, RF signal traces, and other sensitive signal traces.
It is important to route the USB differential traces in the inner layer with ground shielding on not only the upper and lower layers but also the right and left sides.
Connect a common-mode choke between the MCU and the module in series to improve EMI suppression.
Considering the connection to micro-USB devices, place the TVS diode as close to the USB port as possible with a parasitic capacitance of less than 2 pF.

إس بي آي

The T5-E1 module has two sets of SPI interfaces, and the following table details the pins.

رقم التعريف الشخصي	إشارة	ميزة
26	SPI0_CSN	GPIO15, SPI0 chip select signal
28	SPI0_MOSI	GPIO16, SPI0 controller out and agent in
29	SPI0_MISO	GPIO17, SPI0 controller in and agent out
27	SPI0_SCK	GPIO14, SPI0 clock signal
22	SPI1_CSN	GPIO3, SPI1 chip select signal
21	SPI1_MOSI	GPIO4, SPI1 controller out and agent in
20	SPI1_MISO	GPIO5, SPI1 controller in and agent out
23	SPI1_SCK	GPIO2, SPI1 clock signal

Electrical specifications and applications

المجلدtage level of the SPI interface on this module is 3.3V. A level translator should be used if the application is equipped with a 5V UART interface. A level translator for SPI is recommended.

The reference circuit is shown in the figure below:

كيو إس بي آي

The T5-E1 module has two sets of QSPI interfaces, and the following table details the pins.

رقم التعريف الشخصي	إشارة	ميزة
6	QSPI0_SCK	GPIO22, QSPI0 clock signal
7	QSPI0_CS	GPIO23, QSPI0 enable signal
8	QSPI0_IO0	GPIO24, QSPI0 data bit 0
9	QSPI0_IO1	GPIO25, QSPI0 data bit 1
10	QSPI0_IO2	GPIO26, QSPI0 data bit 2
41	QSPI0_IO3	GPIO27, QSPI0 data bit 3
18	QSPI1_IO3	GPIO7, QSPI1 data bit 3
19	QSPI1_IO2	GPIO6, QSPI1 data bit 2
20	QSPI1_IO1	GPIO5, QSPI1 data bit 1
21	QSPI1_IO0	GPIO4, QSPI1 data bit 0
22	QSPI1_CS	GPIO3, QSPI1 enable signal
23	QSPI1_SCK	GPIO2, QSPI1 clock signal

اي 2 سي

The T5-E1 module has two sets of I2C interfaces, and the following table details the pins.

رقم التعريف الشخصي	إشارة	ميزة
4	I2C0_SCL	GPIO20, I2C0 clock signal
5	I2C0_SDA	GPIO21, I2C0 data signal
15	I2C1_SCL	GPIO0, I2C1 clock signal
12	I2C1_SDA	GPIO1, I2C1 data signal

I2C is a simple serial communication bus protocol that uses just two bus wires, a serial data wire (SDA) and a serial clock wire (SCL).
I2C is integrated into many ICs and allows devices to communicate directly with each other.
Each device is recognized by a unique address to differentiate from other devices on the same I2C bus and can operate either as a transmitter or a receiver, depending on its function.

التطبيقات

The I2C bus must be pulled up on the device.

I2S

The T5-E1 module has three sets of I2S interfaces, and the following table details the pins.

رقم التعريف الشخصي	إشارة	ميزة
11	I2S_MCLK	GPIO28, main clock signal
16	I2S0_DOUT	GPIO9, I2S0 output signal
17	I2S0_DIN	GPIO8, I2S0 input signal
18	I2S0_SYNC	GPIO7, I2S0 sync signal
19	I2S0_SCK	GPIO6, I2S0 clock signal
32	I2S2_DOUT	GPIO47, I2S2 output signal
33	I2S2_DIN	GPIO46, I2S2 input signal
34	I2S2_SYNC	GPIO45, I2S2 sync signal
35	I2S2_SCK	GPIO44, I2S2 clock signal
38	I2S1_DOUT	GPIO43, I2S1 output signal
39	I2S1_DIN	GPIO42, I2S1 input signal
45	I2S1_SYNC	GPIO41, I2S1 sync signal
65	I2S1_SCK	GPIO40, I2S1 clock signal

سديو

The T5-E1 module has one set of SDIO interfaces, and the following table details the pins.

رقم التعريف الشخصي	إشارة	ميزة
20/29	بيانات SDIO_1	GPIO5/GPIO17, SDIO data bit 1
21/28	بيانات SDIO_0	GPIO4/GPIO16, SDIO data bit 0
22/26	SDIO_CMD	GPIO3/GPIO15, SDIO command
23/27	SDIO_CLK	GPIO2/GPIO14, SDIO clock
36/30	بيانات SDIO_2	UART0_RX/GPIO18, SDIO data bit 2
37/31	بيانات SDIO_3	UART0_TX/GPIO19, SDIO data bit 3

التطبيقات

تصميم الدوائر

Reserve a 22Ω resistor between the SD_CLK and the SD signal trace in series to reduce RF interference.
Reserve a pad for a 0201 33 pF capacitor on the SD signal trace.
SD_DATA[0:3] و SD_CMD have reserved pull-up resistors to increase bus stability.
ال SD_CLK The signal trace needs ground shielding individually. Its length should be as short as possible, within 2,500 mil, preferably within 2,000 mil.
Surround SD signal traces with total grounding to prevent any possible crosstalk and noise coupling from other signal sources.
It is recommended to keep the same trace length for SD_CLK, SD_DATA[0:3]، و SD_CMD, with a length difference of less than 1 mm. The total length should not exceed 50 mm.
In order to offer good ESD protection, it is recommended to add an ESD diode array with a parasitic capacitance of less than 15 pF.
The ESD protection device should be placed as close as possible to the SIM card connector 3V3. SD_CLK, SD_DATA[0:3]، و SD_CMD. Make sure the SIM card signal lines go through the ESD protection device first and then to the module.

آلة تصوير

وصف الدبوس

رقم التعريف الشخصي	إشارة	ميزة
41	CIS_MCLK	GPIO27, driver clock that is output to the sensor
42	CIS_PCLK	GPIO29, pixel clock
46	CIS_VSYNC	GPIO31, frame sync signal
47	CIS_HSYNC	GPIO30, horizontal sync signal
48	CIS_PXD1	GPIO33, pixel data, data bit 1
49	CIS_PXD0	GPIO32, pixel data, data bit 0
51	CIS_PXD2	GPIO34, pixel data, data bit 2
52	CIS_PXD3	GPIO35, pixel data, data bit 3
56	CIS_PXD4	GPIO36, pixel data, data bit 4
57	CIS_PXD5	GPIO37, pixel data, data bit 5
63	CIS_PXD6	GPIO38, pixel data, data bit 6
64	CIS_PXD7	GPIO39, pixel data, data bit 7

DVP requires a set of I2C interfaces to configure the sensor.

التطبيقات

ار جي بي 565

وصف الدبوس

رقم التعريف الشخصي	إشارة	ميزة
31	RGB_R7	GPIO19, RGB red component, data bit 7
4	RGB_R6	GPIO20, RGB red component, data bit 6
5	RGB_R5	GPIO21, RGB red component, data bit 5
6	RGB_R4	GPIO22, RGB red component, data bit 4
7	RGB_R3	GPIO23, RGB red component, data bit 3
8	RGB_G7	GPIO24, RGB green component, data bit 7
9	RGB_G6	GPIO25, RGB green component, data bit 6
10	RGB_G5	GPIO26, RGB green component, data bit 5
65	RGB_G4	GPIO40, RGB green component, data bit 4
45	RGB_G3	GPIO41, RGB green component, data bit 3
39	RGB_G2	GPIO42, RGB green component, data bit 2
38	RGB_B7	GPIO43, RGB blue component, data bit 7
35	RGB_B6	GPIO44, RGB blue component, data bit 6
34	RGB_B5	GPIO45, RGB blue component, data bit 5
33	RGB_B4	GPIO46, RGB blue component, data bit 4
32	RGB_B3	GPIO47, RGB blue component, data bit 3
27	RGB_DCLK	GPIO14, clock signal
26	RGB_DISP	GPIO15, display on/off
29	RGB_HSYNC	GPIO17, horizontal sync signal
30	RGB_VSYNC	GPIO18, vertical sync signal
28	RGB_DE	GPIO16, data enable signal

إيثرنت

وصف الدبوس

رقم التعريف الشخصي	إشارة	ميزة
41	ENET_PHY_INT	GPIO27, interrupt signal
42	ENET_MDC	GPIO29, bus clock signal
48	ENET_RXD0	GPIO33, data receiving signal, bit 0
49	ENET_MDIO	GPIO32, management data input and output signals
51	ENET_RXD1	GPIO34, data receiving signal, bit 1
52	ENET_RXDV	GPIO35, data receiving a valid signal
56	ENET_TXD0	GPIO36, data sending signal, bit 0
57	ENET_TXD1	GPIO37, data sending signal, bit 1
63	ENET_TXEN	GPIO38, data sending enable signal
64	ENET_REF_CLK	GPIO39, reference clock signal

التطبيقات

يلمس

The T5-E1 module provides 16 capacitive sensing GPIOs, and the following table details the pins.

رقم التعريف الشخصي	إشارة	ميزة
11	ص28	تاتش2
24	ص12	تاتش0
25	ص13	تاتش1
32	ص47	تاتش15
33	ص46	تاتش14
42	ص29	تاتش3
46	ص31	تاتش5
47	ص30	تاتش4
48	ص33	تاتش7
49	ص32	تاتش6
51	ص34	تاتش8
52	ص35	تاتش9
56	ص36	تاتش10
57	ص37	تاتش11
63	ص38	تاتش12
64	ص39	تاتش13

When using the touch feature, it is recommended to reserve a series resistor close to the module to reduce coupling noise and interference on the line and to enhance ESD protection.
The recommended resistance value is 470 Ω to 2 kΩ, with 510 Ω preferred. The specific value depends on the actual test results of the product.
The traces should be as short and thin as possible, with a length less than 300 mm, a width no greater than 0.18 mm, and a trace angle greater than or equal to 90°.
The spacing between different touch channels should be as far as possible, and they should be away from RF, I2C, SPI, and high-speed signal lines.
The touch electrodes and traces are surrounded by a grid ground, and the trace clearance from the ground ranges from 0.5 mm to 1 mm.
The diameter of the touch electrodes ranges from 8 mm to 15 mm.

المتحدث

وصف الدبوس

رقم التعريف الشخصي	إشارة	ميزة
61	LN	`AUDL_N`, audio negative output
62	LP	`AUDL_P`, audio positive output

التطبيقات

ميك

وصف الدبوس

رقم التعريف الشخصي	إشارة	ميزة
66	إم بي 1	`MIC1_P`, positive input of microphone 1
67	م ن 1	`MIC1_N`, negative input of microphone 1
68	م ن 2	`MIC2_N`, negative input of microphone 2
69	إم بي 2	`MIC2_P`, positive input of microphone 2
70	م ب س	`MICBIAS`, microphone bias voltage

التطبيقات

If only one MIC is used, MIC1 must be used.

مزود الطاقة

حجم التشغيلtage range of the T5-E1 module is 2.0V to 3.6V, with a typical value of 3.3V. The supply current for 3.3V modules must be greater than the maximum input current. The total capacity of the external filter capacitor should be greater than 10 μF.
Place the filter capacitors C1 and C2 near the power pin of the module.

Pins of the module

The GPIO might experience an uncontrollable high level within five milliseconds of starting the module (before the program startup). Place a 4.7 kΩ pull-down resistor if needed.
The RST pin of the module is a hardware reset pin. The module has internal weak pull-up resistors configured. If the pin is not used, it can float. If a module has been paired, this pin cannot be used to clear pairing information.
The TX1 pin on the module is used to select a mode. Pulling TX1 down before the module is powered on will start the test firmware, while floating it or pulling it up will start the application firmware. In normal use, this pin is used as a log printing port.
Other unused pins can be left floating.
For more information about pin configuration, see the module datasheet.

Power-on sequence of the module

Suppose that the high-level voltage settling time of the module’s GPIO is t2 والمجلدtage settling time of the module’s power pin is t1. Every time the module is powered on, t2 it must be greater than or equal to t1.

كما هو موضح في الشكل التالي:

If t2 أقل من t1The module might fail to start.
- To return the module to its normal state, pull down the module reset pin (RST) for one millisecond and pull up to restart the module.
- Repeatedly power-cycling the module power pin will not restore it to its normal state.

تصميم منخفض الطاقة

Option 1: Control the module power pin on/off

This circuit design can achieve overall low power consumption.
كيف يعمل: As shown in the circuit diagram, the MCU can control the switch S1 with the GPIO pin to power on/off the module.
When the MCU has data to report to the cloud, it turns it S1 on. Then, the module can receive data from the MCU and report data to the cloud and the mobile app.
When data reporting is completed, the module will be powered off and consume no power.

Disadvantages:

Current sinking occurs. When the switch S1 is turned off, the TXD and RXD pins on the module are still connected to the RXD and TXD pins on the MCU.
Therefore, the current from the MCU can flow into the VCC pin of the module through the UART pin.
The TXD and RXD pins of the module are high, so the current sinking will increase the consumption of the module.
عندما يكون التبديل S1 is turned on next time, t2 it will be less than t1, which can cause the module to freeze.

الحل 1: Optimize the software of the MCU without hardware modification. When the MCU detects that the data reporting is completed, the program proceeds with the following steps.

Set the TXD and RXD pins of the MCU as GPIO pins that are configured as the open-drain or weak pull-down mode.
قم بتشغيل المفتاح S1 off to power off the module.
This way, when the MCU has data to report, it turns S1 في البداية.
Then, it configures the TXD and RXD pins as the UART to establish communication with the module for data transmission.

مهم

This solution does not apply to MCUs whose UART pin cannot be configured as the open-drain or weak pull-up mode.
If the UART circuit has a pull-up resistor, one terminal of the resistor must be connected to the VCC pin of the module, or you can directly remove this resistor.
- الحل 2: Add a level translator to the circuit without software modification.
- See the circuit diagram in the preceding sections, Level translator reference, and Connection between a module and a 3.3V MCU, and embed a level translator in the UART circuit.

Option 2: Reduce power usage in the idle state

Pull down the module’s RST pin to reduce idle consumption.
كيف يعمل: As shown in the circuit diagram, the MCU can control the RST pin with the GPIO pin to power on/off the module.
When the MCU has data to report to the cloud, the GPIO outputs high to power on the module. Then, the module can receive data from the MCU and report data to the cloud and the mobile app.
When data reporting is completed, the GPIO outputs low and the module runs in reset mode with low power consumption.
Disadvantage: The RST pin has a 10 kΩ internal pull-up resistor, so the module has an input current of 330 μA in the reset mode.

Radio frequency RF test

The antenna is susceptible to the distance from the shell to the surrounding components. We recommend that you test the RF performance after the final test.
The RF test items and metrics are listed in the following table.

عنصر الاختبار	Test metric
increasing indoor distance	≥ 50م
increasing outdoor distance	≥ 75م
Total radiated power (TRP) in the signaling mode of end devices (test mode of 11B 11 Mbit/s).	≥ 10 ديسيبل
Total isotropic sensitivity (TIS) in the signaling mode of end devices (test mode of 11B 11 Mbit/s).	≤ -83 ديسيبل

TRP and TIS must be tested in a dark chamber of the antenna manufacturers or certified organizations.
The test items apply to most Wi-Fi products, excluding certain special products.

هوائي

Antenna clearance

Do not use metal shells or plastic shells with metallic paint or coating in the direction of the antenna radiation. Do not use metal objects such as screws and rivets near the antenna, which might affect the antenna’s efficiency.
The distance between the antenna and other mental components should be at least 15 mm.
Try to increase the distance from the top shell to the antenna to minimize the impact on antenna performance.
Try to increase the distance from the upper and bottom shells to the antenna to minimize the impact on antenna performance.
Keep the module away from speakers, power switches, cameras, HDMI, USB, and other high-speed signals to avoid interference.
Avoid metal shielding near the antenna. If co-channel interference occurs, you must evaluate the impact on the antenna performance and ensure isolation from interference.
According to the antenna shape of the T5-E1 module, you can choose Position 3 or Position 4 (optimal) when using the module.
That is to say, the antenna feed point should be as close to the edge of the board as possible. The position marked with a red dot in the figure below shows where the T5-E1 antenna feed point is.

Packing and manufacturing

Mechanical dimensions and backside pad dimensions

SMT package

The tolerances for dimensions of length and width, height, and PCB thickness are ±0.35 mm, ±0.15 mm, and ±0.1 mm, respectively.

الأسئلة الشائعة

How do I know if the T5 Module is compatible with my device?

The T5 Module is compatible with devices that have a compatible slot for insertion. Refer to your device's specifications or consult with the manufacturer for compatibility information.

Can I use the T5 Module with multiple devices?

The T5 Module can typically be moved between compatible devices, but ensure that each device recognizes and configures the module properly before use.

المستندات / الموارد

tuya T5 Module Developer Platform [بي دي اف] تعليمات
T5-E1, T5-E1-IPEX, T5 Module Developer Platform, T5, Module Developer Platform, Developer Platform, Platform

مراجع

دليل المستخدم

Tuya T5 Module Developer Platform

معلومات المنتج

تعليمات استخدام المنتج

مقدمة

زيادةview

مظهر

Pins on the module

Pin configuration and features

Serial communication between the module and the MCU

تصميم الدوائر

Electrical specifications and applications

آلة تصوير

تصميم منخفض الطاقة

Radio frequency RF test

هوائي

Packing and manufacturing

الأسئلة الشائعة

المستندات / الموارد

مراجع

اترك تعليقا

إلغاء الرد